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Wafer Cleaning Machine Product List and Ranking from 6 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

Wafer Cleaning Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

  1. 株式会社ダン科学 入間営業所 Saitama//Industrial Machinery
  2. ソフエンジニアリング Saitama//Industrial Electrical Equipment
  3. ダルトン Tokyo//Industrial Machinery
  4. 4 コーホーテクノ Tokyo//Manufacturing and processing contract
  5. 5 ＳＤＩ 京都本社 Kyoto//Manufacturing and processing contract
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Wafer Cleaning Machine Product ranking

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

  1. Wafer cleaning device "Double-sided brush cleaning device (mass production type)" 株式会社ダン科学 入間営業所
  2. Spin & conveyor processing equipment (etching, cleaning, stripping) ソフエンジニアリング
  3. Wafer cleaning device "Double-sided scrub cleaning device (for research and development)" 株式会社ダン科学 入間営業所
  4. 4 Wafer cleaning device コーホーテクノ
  5. 5 Wafer cleaning device "Double-sided scrub cleaning device (for research and development)" 株式会社ダン科学 入間営業所

Wafer Cleaning Machine Product List

1～12 item / All 12 items

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Single-wafer automatic cleaning device "RCA Wafer Cleaning System"

Single-wafer automatic cleaning device "RCA Wafer Cleaning System"

Customization is okay! We offer quick responses and after-sales support unique to manufacturers.

The "RCA Wafer Cleaning System" is an automatic cleaning device primarily based on the RCA cleaning method, widely adopted as a highly reliable cleaning method. With a "3-axis multi-joint clean robot" for wafer transport and "FOUP" used for loaders and unloaders, it achieves cleaning in a non-particle environment. 【Features】 ■ Quick response from estimates to customization ■ Support for our own equipment as well as other manufacturers' equipment ■ Detailed response to sudden specification changes *For more details, please download the catalog or contact us. 【Exhibition Information】 SEMICON Japan Location: Tokyo Big Sight Period: December 13-15, 2017 Booth Number: 3509, East Hall

  • Other semiconductor manufacturing equipment
  • Wafer Cleaning Machine

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Cleaning device SA-1109

Cleaning device SA-1109

Wafer cleaning equipment. Ideal for customers requiring high-spec cleanliness.

This device is optimal for customers who require high specifications of cleanliness. It is an automated device that processes each step automatically according to the set recipe parameters for five Max 8-inch wafers simultaneously. It is a dip coater-type cleaning device that reflects the dip coating technology owned by SDI. For more details, please contact us.

  • Other cleaning machines
  • Wafer Cleaning Machine

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Wafer cleaning device (batch type) *Testable models available

Wafer cleaning device (batch type) *Testable models available

We propose specifications that consider cost reduction through wet etching.

We achieve low cost and high productivity unique to wet etching. We can accommodate various transport positions and methods according to your needs, and customization with additional mechanisms is also possible. 【Features】 ■ Fully automatic acid and alkaline etching (cleaning) equipment ■ Manual acid and alkaline etching (cleaning) equipment ■ RCA cleaning equipment ■ In addition to front transport type and rear upper transport type, we can also accommodate upper transport type and rear transport type according to customer needs. ■ You can choose from carrierless transport, carrier transport, carrier hanger transport, etc., according to your budget. ■ Additional handover mechanisms with front and rear devices and external communication functions are possible. ■ Automatic doors, automatic lids, automatic chemical supply, weighing, and recovery devices can be equipped. ■ It is possible to equip a concentration management mechanism for etching solutions. Please consult us regarding the target chemicals (e.g., TMAH, KOH, HF, HCL, etc.). ■ Temperature distribution measurement in the etching processing tank can be performed as a pre-shipment inspection. ■ In addition to the up-and-down oscillation mechanism, a wafer rotation mechanism can also be added. * Testing can be conducted at our Tokyo Test Center (Sumida Ward). (Online support available) * For more details, please download the catalog or feel free to contact us.

  • Etching Equipment
  • Wafer Cleaning Machine

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Wafer cleaning device (spin type) *Testable models available

Wafer cleaning device (spin type) *Testable models available

Supports multiple chambers according to production scale. Achieves uniform etching of wafers.

Automatic Acid and Alkali Cleaning Device Compatible Work Sizes: φ2 to 12 inches. Please consult us for special sizes such as square substrates. The cleaning process is achieved by directly using two types of concentrated solutions through a two-fluid mixing nozzle. By adjusting the mixing ratio, it is possible to raise the temperature to the desired level using the reaction heat. 【Other Features】 ■ Capable of manufacturing devices with brush cleaning functions ■ Capable of manufacturing photo mask cleaning devices ■ Chemical supply and recovery unit can be integrated into the main device ■ Ozone water cleaning available as an option ■ Nanobubble cleaning available as an option You can conduct tests at our Tokyo Test Center. (Online support available) *For more details, please download the PDF (catalog) or feel free to contact us.

  • Resist Device
  • Wafer Cleaning Machine

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Spin & conveyor processing equipment (etching, cleaning, stripping)

Spin & conveyor processing equipment (etching, cleaning, stripping)

High-quality substrates can be provided with high throughput and low cost!

- Ideal for etching and cleaning processes. - Chemical treatment is done using a spin method, and rinse drying is done using a conveyor method. - Proven track record of high throughput support with W-lane configuration. - Measures against hazardous corrosive gases during etching: ◎ Equipped with front and rear shutters and rollers in the spin chamber. - Features temperature control circulation and reuse function for chemicals, as well as concentrated/diluted separation function for wastewater. - Swing spray function during rinsing can also be installed. - Up and down air knife drying designed to prevent reattachment of rinse water splashes. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic, cleaning equipment, resist, photoresist, photolithography process, silicon, scrub cleaning equipment, scrub cleaning, wafer stripping equipment, wafer cleaning equipment, wafer cleaning machine.

  • Ultrasonic Cleaner
  • Wafer Cleaning Machine

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Wafer cleaning device "Double-sided brush cleaning device (mass production type)"

Wafer cleaning device "Double-sided brush cleaning device (mass production type)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download and view the catalog.

  • Other cleaning machines
  • Wafer Cleaning Machine

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Wafer cleaning device

Wafer cleaning device

We would like to introduce our main products and achievements!

We would like to introduce our "Wafer Cleaning Equipment" that we offer. We have a variety of products available, including automatic RCA cleaning equipment and automatic wet stations. We also have a lineup that includes 12-inch wafer cleaning equipment. Please feel free to contact us when you need assistance. 【Product Lineup】 ■ Automatic RCA Cleaning Equipment ■ Automatic Wet Station ■ Automatic Cleaning Equipment After CMP ■ 12-Inch Wafer Cleaning Equipment *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment
  • Wafer Cleaning Machine

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Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"

Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Wafer Cleaning Machine

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Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"

Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Simultaneous cleaning of both sides is possible ■ Wafer types for cleaning: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8” (thickness to be discussed) ■ Supports transparent wafers as well *For more details, please contact us or download and view the catalog.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment
  • Wafer Cleaning Machine

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Wafer cleaning device "Double-sided brush cleaning device (for research and development)"

Wafer cleaning device "Double-sided brush cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry cleaning with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.

  • Other cleaning machines
  • Wafer Cleaning Machine

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Wafer cleaning device "Double-sided brush cleaning device (for research and development)"

Wafer cleaning device "Double-sided brush cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8” (thickness to be discussed) ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment
  • Wafer Cleaning Machine

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Wafer cleaning device "Double-sided brush cleaning device (mass production type)"

Wafer cleaning device "Double-sided brush cleaning device (mass production type)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It enables transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

  • Other cleaning machines
  • Ultrasonic Cleaner
  • Other semiconductor manufacturing equipment
  • Wafer Cleaning Machine

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